The global HDI printed circuit board market is anticipated to reach USD 24.63 Billion by 2025, while augmenting at a CAGR of 12.8%. The market growth is attributed to the increasing miniaturization of electronic devices, rapid inclination of consumers towards smart devices, and significant growth in consumer electronics as well as increasing adoption of safety measures in automobile. Additionally, increasing adoption of smart wearables is also likely to fuel the demand for high density interconnect PCBs over the forecast period. However, the high cost coupled with lack of expertise in manufacturing HDI printed circuit board is expected to impede the market growth to during 2019-2025.
The evolution of high-density interconnect PCB is providing greater design flexibility, and allows the circuit designers to place more components on both sides of the raw PCB. Moreover, high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality. In addition, HDI PCBs are deployed in wide range of digital devices such as smart phones and tablets, where miniaturization of the product is important.
The years used for the assessment are as follows;
RESEARCH METHODOLOGY
The research and analysis are based on data and information obtained from various primary and secondary sources. The data obtained is validated by interacting with the companies of the concerned domain. The steps involved in the research methodology are;
OBJECTIVES:
CHAPTER 1. Market Scope and Methodology
1.1. Research Methodology
1.2. Research Scope & Assumptions
1.3. List of Data Sources
CHAPTER 2. Executive Summary
2.1. High Density Interconnect (HDI) Printed Circuit Board- Market Snapshot
CHAPTER 3. Industry Analysis
3.1. Market Definition
3.2. Market Segmentation
3.3. Key Findings of the Global High Density Interconnect PCB Market
3.4. Market Opportunities & Trends
3.4.1. Increasing adoption of safety measures in automobile
3.5. Market Dynamics
3.5.1. Market driver analysis
3.5.1.1. Increasing miniaturization of electronic devices
3.5.1.2. Rapid inclination of consumers toward smart devices
3.5.1.3. Significant growth in consumer electronics industry
3.5.2. Market restraint analysis
3.5.2.1. High manufacturing cost
3.5.2.2. Lack of expertise in manufacturing HDI printed circuit board
CHAPTER 4. Competitive Outlook
4.1. Company Share Analysis
4.2. Porters-Five Forces Analysis
4.3. Competitive factors
CHAPTER 5. Global HDI Printed Circuit Board Market Size and Forecast (2019-2025)
5.1. Global HDI Printed Circuit Board Market, By Layer (USD Billion)
5.1.1. 4-6 Layers
5.1.2. 8-10 Layers
5.1.3. 12 and above layers
5.2. Global HDI Printed Circuit Board Market, By Application (USD Billion)
5.2.1. Smartphone & Tablet
5.2.2. Laptops and Computers
5.2.3. Displays
5.2.4. Connected Devices
5.2.5. Smart Wearables
5.2.6. Others
5.3. Global HDI Printed Circuit Board Market, By End-Use (USD Billion)
5.3.1. Consumer Electronics
5.3.2. Industrial Electronics
5.3.3. Military and defense
5.3.4. IT & Telecommunication
5.3.5. Automotive
5.3.6. Healthcare
5.3.7. Others
CHAPTER 6. Global HDI Printed Circuit Board Market Size and Forecast, By Geography (2019-2025)
6.1. North America HDI Printed Circuit Board Market (USD Billion)
6.1.1. North America HDI Printed Circuit Board Market, By Layer (USD Billion)
6.1.2. North America HDI Printed Circuit Board Market, By Application (USD Billion)
6.1.3. North America HDI Printed Circuit Board Market, By End-Use (USD Billion)
6.1.4. North America HDI Printed Circuit Board Market, By Country (USD Billion)
6.1.4.1. U.S.
6.1.4.2. Canada
6.2. Europe HDI Printed Circuit Board Market (USD Billion)
6.2.1. Europe HDI Printed Circuit Board Market, By Layer (USD Billion)
6.2.2. Europe HDI Printed Circuit Board Market, By Application (USD Billion)
6.2.3. Europe HDI Printed Circuit Board Market, By End-Use (USD Billion)
6.2.4. Europe HDI Printed Circuit Board Market, By Country (USD Billion)
6.2.4.1. UK
6.2.4.2. Germany
6.2.4.3. France
6.2.4.4. Russia
6.2.4.5. Rest of Europe
6.3. Asia-Pacific HDI Printed Circuit Board Market (USD Billion)
6.3.1. Asia-Pacific HDI Printed Circuit Board Market, By Layer (USD Billion)
6.3.2. Asia-Pacific HDI Printed Circuit Board Market, By Application (USD Billion)
6.3.3. Asia-Pacific HDI Printed Circuit Board Market, By End-Use (USD Billion)
6.3.4. Asia-Pacific HDI Printed Circuit Board Market, By Country (USD Billion)
6.3.4.1. China
6.3.4.2. Japan
6.3.4.3. India
6.3.4.4. South Korea
6.3.4.5. Rest of Asia-Pacific
6.4. Central & South America (CSA) HDI Printed Circuit Board Market (USD Billion)
6.4.1. Central & South America HDI Printed Circuit Board Market, By Layer (USD Billion)
6.4.2. Central & South America HDI Printed Circuit Board Market, By Application (USD Billion)
6.4.3. Central & South America HDI Printed Circuit Board Market, By End-Use (USD Billion)
6.4.4. Central & South America HDI Printed Circuit Board Market, By Country (USD Billion)
6.4.4.1. Brazil
6.4.4.2. Mexico
6.4.4.3. Rest of Central & South America
6.5. Middle East and Africa (MEA) HDI Printed Circuit Board Market (USD Billion)
6.5.1. MEA HDI Printed Circuit Board Market, By Layer (USD Billion)
6.5.2. MEA HDI Printed Circuit Board Market, By Resolution (USD Billion)
6.5.3. MEA HDI Printed Circuit Board Market, By Application (USD Billion)
6.5.4. MEA HDI Printed Circuit Board Market, By Country (USD Billion)
6.5.4.1. South Africa
6.5.4.2. Rest of MEA
CHAPTER 7. Key Players and Strategic Developments
7.1. AT&S
7.1.1. Business Overview
7.1.2. Product and Service Offering
7.1.3. Financial Overview
7.1.4. Strategic Developments
7.2. Unimicron Corporation
7.2.1. Business Overview
7.2.2. Product and Service Offering
7.2.3. Financial Overview
7.2.4. Strategic Developments
7.3. TTM Technologies
7.3.1. Business Overview
7.3.2. Product and Service Offering
7.3.3. Financial Overview
7.3.4. Strategic Developments
7.4. Zhen Ding Tech
7.4.1. Business Overview
7.4.2. Product and Service Offering
7.4.3. Financial Overview
7.4.4. Strategic Developments
7.5. Epec, LLC.
7.5.1. Business Overview
7.5.2. Product and Service Offering
7.5.3. Financial Overview
7.5.4. Strategic Developments
7.6. Unitech
7.6.1. Business Overview
7.6.2. Product and Service Offering
7.6.3. Financial Overview
7.6.4. Strategic Developments
7.7. TTM TECHNOLOGIES
7.7.1. Business Overview
7.7.2. Product and Service Offering
7.7.3. Financial Overview
7.7.4. Strategic Developments
7.8. NCAB GROUP CORPORATION
7.8.1. Business Overview
7.8.2. Product and Service Offering
7.8.3. Financial Overview
7.8.4. Strategic Developments
7.9. Sierra Circuits
7.9.1. Business Overview
7.9.2. Product and Service Offering
7.9.3. Financial Overview
7.9.4. Strategic Developments
7.10. Millennium Circuits Limited
7.10.1. Business Overview
7.10.2. Product and Service Offering
7.10.3. Financial Overview
7.10.4. Strategic Developments
7.11. Mistral Solutions Pvt. Ltd.
7.11.1. Business Overview
7.11.2. Product and Service Offering
7.11.3. Financial Overview
7.11.4. Strategic Developments