Global High Density Interconnect (HDI) Printed Circuit Board (PCB) Market Size, Share, Forecast Report 2019-2025

The global HDI printed circuit board market is anticipated to reach USD 24.63 Billion by 2025, while augmenting at a CAGR of 12.8%. The market growth is attributed to the increasing miniaturization of electronic devices, rapid inclination of consumers towards smart devices, and significant growth in consumer electronics as well as increasing adoption of safety measures in automobile. Additionally, increasing adoption of smart wearables is also likely to fuel the demand for high density interconnect PCBs over the forecast period. However, the high cost coupled with lack of expertise in manufacturing HDI printed circuit board is expected to impede the market growth to during 2019-2025.

The evolution of high-density interconnect PCB is providing greater design flexibility, and allows the circuit designers to place more components on both sides of the raw PCB. Moreover, high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality. In addition, HDI PCBs are deployed in wide range of digital devices such as smart phones and tablets, where miniaturization of the product is important.

The years used for the assessment are as follows;

• Historic years: 2015, 2016 and 2017
• Base year: 2018
• Forecast period: 2019 – 2025

RESEARCH METHODOLOGY

The research and analysis are based on data and information obtained from various primary and secondary sources. The data obtained is validated by interacting with the companies of the concerned domain. The steps involved in the research methodology are;

• Obtaining historical data of the market based on news, articles, publications, annual reports, white papers, and other secondary sources
• Interacting with key opinion leaders of the market and developing data points based on interaction with them
• Study of past trends in the market and their year on year impact on the market size and share
• Analyzing the collected data points
• Bridging the data points to calculate the total HDI printed circuit board market and its various segments
• Anticipating potential risks
• Analyzing market forces such as drivers, restraints, and opportunities to assess new growth areas for the HDI printed circuit board market
• Finalizing the overall size and share for the global HDI printed circuit board market

OBJECTIVES:

• To classify the global HDI printed circuit board market into segments and analyze their growth prospects individually.
• To analyze market trends, opportunities, drivers and restraints associated with the HDI printed circuit board market.
• Profiling key companies operating in the global HDI printed circuit board market
• To study market response with respect to the mergers and acquisitions in the industry