Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size, Share, Forecast Report, 2020-2027

The global E-Scrap and Printed Circuit Board (PCB) E-Scrap market garnered revenue around USD XX Billion in 2019 and projected to reach USD XX Billion in 2027, with at a compound annual growth rate of 5.6% throughout the estimate period from 2020 to 2027.

The waste management industry has been utilizing printed circuit board scraps (PCB e-scraps) for extracting useful materials. PCB e-scrap has been source to new materials, given the recent consumer consumption patterns, especially of households in developing and developed economies. The drive for e-scrap and PCB e-scrap market has further received traction on account of deployment of new waste-collection methods, recycling technology, and treatment methods. Governments in collaboration with the industry has put equal focus on all the elements, thereby bringing new avenues for investments for stakeholders in e-scrap collection and recycling markets. To a great deal, their focus gathers strength from the increasing trend of recycling for circular economy and the need for reducing the environment impact of these scraps if they are not adequately disposed of recycled. The last factor is due to a large part of the recycling is done by the informal sector.

This research report encompasses precise assessment of the market with the help of comprehensive qualitative insights and supportable prognoses regarding market size, consumption and production. The projections presented in the report have been derived using proven research methodologies and assumptions. It does so by means of comprehensive qualitative insights, historical statistics, and verifiable predictions about market revenue and sales.

The rapidly budding threat owed to the eruption of COVID-19 is impacting lives, communities, businesses, and industries across the globe. With businesses shuttered, flights grounded, COVID-19 is about to affect the global economy in different ways such as by directly upsetting production and demand, by generating supply chain disruption, and by its financial impact on firms and financial markets. Therefore, this report covers COVID-19 outbreak impact analysis on the E-Scrap and Printed Circuit Board (PCB) E-Scrap market under the research study. The market estimates offered in the report are the outcome of in-depth extensive secondary research, primary interviews and in-house professional assessments. These market evaluations have been measured by reviewing the impact of numerous social, political and economic factors coupled with recent market dynamics affecting the E-Scrap and Printed Circuit Board (PCB) E-Scrap market growth.

The global E-Scrap and Printed Circuit Board (PCB) E-Scrap market is characterized by the presence of numerous small as well as medium scale companies. These players are largely focused towards forward integration via raw material production, product manufacturing, and distribution across various industry verticals. The report recognizes numerous crucial manufacturers of the market. This research study aids to comprehend the strategies and associations that companies are converging to survive in this competitive marketplace. This report assists in understanding footprints of the manufacturers with the help of their global revenue, production, capacity and average selling price analysis for period 2016-2027.

Major manufacturers analysed under this study comprises:

Umicore N.V., LS-Nikko Copper Inc., Boliden Group, Dowa Holdings Co. Ltd., and Ultromext Ltd.

This report delivers market breakdown and its revenue, consumption, production analysis and projections by categorizing it depending on parameters such as type, application/end-user, and region. This research report delivers the analysis and prognosis of revenue, production, price, market share and growth trend for different products such as:

E-Scrap Source

• Household Appliances

• IT and Telecommunication Products

• Smartphones

• Entertainment Devices

• Others

PCB E-Scrap Type

• Telecommunications Circuit Cards

• Network Communication Boards

• Circuit Packs

• PC Motherboards

• Smartphones

• Others

Material Recovered (PCB E-Scrap)

• Ferrous Components

• Metals (Copper, Aluminum, Tin)

• Precious Metals (Gold, Silver, Palladium)

Regional Analysis and Forecast


Further, this research study analyses market size, production, consumption and its advancement trends at global, regional, and country level for period 2016 to 2027 and covers following region in its scope:


• North America

? U.S.

? Canada

• Europe

? Germany

? U.K.

? Italy

? France

? Rest of EU

• Asia Pacific

? China

? India

? Japan

? Southeast Asia

? Rest of APAC

• Central & South America

? Brazil

? Argentina

? Rest of Central & South America

• Middle East and Africa

? UAE

? Saudi Arabia

? Rest of MEA